中华人民共和国住房和城乡建设部公告　第533号

前言

1　总则

2　术语

3　基本规定

• 3.1　施工条件

• 3.2　设备开箱

• 3.3　设备搬运

• 3.4　设备安装

• 3.5　设备调试与试运行

4　低温共烧陶瓷及厚膜基板制造工艺设备安装、调试及试运行

• 4.1　一般规定

• 4.2　流延机

• 4.3　切片机

• 4.4　生瓷打孔机

• 4.5　激光打孔机

• 4.6　微孔填充机

• 4.7　丝网印刷机

• 4.8　叠片机

• 4.9　等静压层压机

• 4.10　热切机

• 4.11　低温共烧陶瓷烧结炉

• 4.12　厚膜烧结炉

• 4.13　激光调阻机

5　薄膜基板制造工艺设备安装、调试及试运行

• 5.1　一般规定

• 5.2　磁控溅射镀膜机

• 5.3　真空蒸发镀膜机

• 5.4　化学气相淀积系统

• 5.5　旋涂及热板系统

• 5.6　曝光机

• 5.7　显影台

• 5.8　反应离子刻蚀机

• 5.9　化学机械抛光机

6　组装封装工艺设备安装、调试及试运行

• 6.1　一般规定

• 6.2　芯片粘片机

• 6.3　芯片共晶焊机

• 6.4　共晶炉

• 6.5　引线键合机

• 6.6　倒装焊机

• 6.7　等离子清洗机

• 6.8　选择性涂覆机

• 6.9　平行缝焊机

• 6.10　储能焊机

• 6.11　激光焊机

7　工艺检测设备安装、调试及试运行

• 7.1　一般规定

• 7.2　飞针测试系统

• 7.3　声学扫描检测系统

• 7.4　3D光学测量仪

• 7.5　自动光学检查仪

• 7.6　激光测厚仪

• 7.7　X射线检查仪

• 7.8　芯片剪切力/引线拉力测试仪

8　工程验收

• 8.1　一般规定

• 8.2　交接验收

• 8.3　竣工验收

• 8.4　验收不合格的处置

附录A　微组装生产线工艺设备安装工程验收记录用表

本规范用词说明

引用标准名录

1 General provisions

2 Terms

3 Basic requirements

• 3.1 Construction conditions

• 3.2 Equipment unpacking

• 3.3 Equipment moving

• 3.4 Equipment installation

• 3.5 Equipment debugging and commissioning

4 Installation，debugging and commissioning of low temperature co-fined ceramic and thick film substrate production process equipment

• 4.1 General requirements

• 4.2 Tape caster

• 4.3 Blanker

• 4.4 Green tape puncher

• 4.5 Laser puncher

• 4.6 Via filling machine

• 4.7 Screen printer

• 4.8 Stacking machine

• 4.9 Isostatic laminator

• 4.10 Hot cutter

• 4.11 Low temperature co-fined ceramic box furnace

• 4.12 Thickfilm belt furnace

• 4.13 Laser resistor trimmer

5 Installation，debugging and commissioning of thin film substrate production process equipment

• 5.1 General requirements

• 5.2 Magnetic sputtering deposition system

• 5.3 Vacuum evaporation copper-coated machine

• 5.4 Chemical vapor deposition system

• 5.5 Spin coating and hot plate system

• 5.6 Exposure machine

• 5.7 Developing system

• 5.8 Reactive ion etching machine

• 5.9 Chemical mechanical polishing machine

6 Installation，debugging and commissioning of assembling and packaging process equipment

• 6.1 General requirements

• 6.2 Die attching machine

• 6.3 Die eutectic bonder

• 6.4 Eutectic oven

• 6.5 Wire bonder

• 6.6 Flip chip bonder

• 6.7 Plasma cleaner

• 6.8 Selective spray coating machine

• 6.9 Parallel seam welder

• 6.10 Energy storage welder

• 6.11 Laser welder

7 Installation，debugging and commissioning of process inspection equipment

• 7.1 General requirements

• 7.2 Probe tester

• 7.3 Acoustic scanner

• 7.4 3Doptical profiler

• 7.5 Automatic optical inspector

• 7.6 Laser thickness gauge

• 7.7 X-ray scanner

• 7.8 Chip shearing/wire pulling tester

8 Engineering acceptance

• 8.1 General requirements

• 8.2 Handover acceptance

• 8.3 Completed acceptance

• 8.4 Disposal of reject

Appendix A Record forms of acceptance for micro-assembling production line process equipment installation engineering

Explanation of wording in this code

List of quoted standards