GB 51037-2014 GB 51037-2014 微组装生产线工艺设备安装工程施工及验收规范：英文

发布日期：2014-08-27

实施日期：2015-05-01

被以下标准替代： GB 51037-2014(2024)

废止日期：2024-10-01

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中文目录

英文目录

中华人民共和国住房和城乡建设部公告

4-40-00

2020年　第129号

住房和城乡建设部关于发布《微组装生产线工艺设备安装工程施工及验收规范》等11项工程建设标准英文版的公告

该11项工程建设标准英文版由住房和城乡建设部组织中国计划出版社有限公司出版发行。

中华人民共和国住房和城乡建设部

2020年5月28日

本书术语

中文目录

中华人民共和国住房和城乡建设部公告

Announcement of the Minstry of Housing and Urban-Rural Development of the People&##x0027;s Republic of China

Foreword

1 General provisions

2 Terms

3 Basic requirements

3.1 Construction conditions

3.2 Equipment unpacking

3.3 Equipment moving

3.4 Equipment installation

3.5 Debugging and commissioning of equipment

4 Installation，debugging and commissioning of low temperature co-fined ceramic and thick film substrate production process equipment

4.1 General requirements

4.2 Tape caster

4.3 Blanker

4.4 Green tape puncher

4.5 Laser scribing machine

4.6 Via filling machine

4.7 Screen printer

4.8 Stacking machine

4.9 Isostatic laminator

4.10 Hot cutter

4.11 Low temperature co-fined ceramic box furnace（LTCC box furnace）

4.12 Thick-film belt furnace

4.13 Laser resistor trimmer

5 Thin film substrate production process equipment installation，debugging and commissioning

5.1 General requirements

5.2 Magnetic sputtering deposition system

5.3 Vacuum evaporative copper-coated machine

5.4 Chemical vapor deposition system

5.5 Spin coating and hot plate system

5.6 Exposure machine

5.7 Developing system

5.8 Reactive ion etching machine

5.9 Chemical mechanical polishing machine

6 Installation，debugging and commissioning of assembling and packaging process equipment

6.1 General requirements

6.2 Die attaching machine

6.3 Die eutectic bonder

6.4 Eutectic oven

6.5 Wire bonder

6.6 Flip chip bonder

6.7 Plasma cleaner

6.8 Selective spray coating machine

6.9 Parallel seam welder

6.10 Energy storage welder

6.11 Laser welder

7 Installation，debugging and commissioning of process inspection equipment

7.1 General requirements

7.2 Probe tester

7.3 Acoustic scanner

7.4 3D optical profiler

7.5 Automatic optical inspector

7.6 Laser thickness gauge

7.7 X-ray scanner

7.8 Chip shearing/wire pulling tester

8 Engineering acceptance

8.1 General requirements

8.2 Handover acceptance

8.3 Completed acceptance

8.4 Disposal of reject

Appendix A Record forms of acceptance for micro-assembling production line process equipment installation engineering

Explanation of wording in this code

List of quoted standards

英文目录

中华人民共和国住房和城乡建设部公告

本书术语

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Announcement　of　the　Minstry　of　Housing　and　Urban-Rural　Development　of　the　People&##x0027;s　Republic　of　China

1　General　provisions

2　Terms

3　Basic　requirements

3.1　Construction　conditions

3.2　Equipment　unpacking

3.3　Equipment　moving

3.4　Equipment　installation

3.5　Debugging　and　commissioning　of　equipment

4　Installation，debugging　and　commissioning　of　low　temperature　co-fined　ceramic　and　thick　film　substrate　production　process　equipment

4.1　General　requirements

4.2　Tape　caster

4.3　Blanker

4.4　Green　tape　puncher

4.5　Laser　scribing　machine

4.6　Via　filling　machine

4.7　Screen　printer

4.8　Stacking　machine

4.9　Isostatic　laminator

4.10　Hot　cutter

4.11　Low　temperature　co-fined　ceramic　box　furnace（LTCC　box　furnace）

4.12　Thick-film　belt　furnace

4.13　Laser　resistor　trimmer

5　Thin　film　substrate　production　process　equipment　installation，debugging　and　commissioning

5.1　General　requirements

5.2　Magnetic　sputtering　deposition　system

5.3　Vacuum　evaporative　copper-coated　machine

5.4　Chemical　vapor　deposition　system

5.5　Spin　coating　and　hot　plate　system

5.6　Exposure　machine

5.7　Developing　system

5.8　Reactive　ion　etching　machine

5.9　Chemical　mechanical　polishing　machine

6　Installation，debugging　and　commissioning　of　assembling　and　packaging　process　equipment

6.1　General　requirements

6.2　Die　attaching　machine

6.3　Die　eutectic　bonder

6.4　Eutectic　oven

6.5　Wire　bonder

6.6　Flip　chip　bonder

6.7　Plasma　cleaner

6.8　Selective　spray　coating　machine

6.9　Parallel　seam　welder

6.10　Energy　storage　welder

6.11　Laser　welder

7　Installation，debugging　and　commissioning　of　process　inspection　equipment

7.1　General　requirements

7.2　Probe　tester

7.3　Acoustic　scanner

7.4　3D　optical　profiler

7.5　Automatic　optical　inspector

7.6　Laser　thickness　gauge

7.7　X-ray　scanner

7.8　Chip　shearing/wire　pulling　tester

8　Engineering　acceptance

8.1　General　requirements

8.2　Handover　acceptance

8.3　Completed　acceptance

8.4　Disposal　of　reject

Appendix　A　Record　forms　of　acceptance　for　micro-assembling　production　line　process　equipment　installation　engineering

Explanation　of　wording　in　this　code

List　of　quoted　standards